High Bandwidth Memory (HBM)

Technology

Last mentioned: Mar 18, 2026

Timeline

  1. Technical Validation

    Expected period for technical validation of Samsung's 3nm GAA process for AMD designs.

  2. CEO Site Visit

    AMD CEO Lisa Su visits Samsung's chip plant in South Korea to discuss expanding ties.

  3. MoU Signing

    Samsung and AMD officially sign an MoU on AI memory and foundry exploration.

Stories mentioning High Bandwidth Memory (HBM) 1

manufacturing Bullish

AMD and Samsung Forge Strategic AI Memory and Foundry Alliance

AMD and Samsung Electronics have signed a Memorandum of Understanding to collaborate on advanced AI memory solutions while exploring a broader foundry partnership. This strategic move aims to secure AMD's supply chain for high-performance computing and challenge TSMC's dominance in the AI chip manufacturing sector.

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